Semiconductor Wafer Inspection & IC Packaging Solutions – Photonic Chip and Optical Waveguide Processing

Compared with electronic integrated circuits, photonic integrated circuits (PICs) hold great potential for the future. The three‑dimensional waveguide structures of quantum photonic chips require femtosecond laser micromachining on the surfaces and in the bulk of transparent materials. Coretech's air‑bearing motion stages offer outstanding 2D accuracy and minimal following error, while the Z‑axis features a compact structure with excellent dynamic performance. These capabilities make them highly suitable for laser processing of optical waveguides, photonic chips, fibre Bragg gratings, and other components.

• Direct‑drive air‑bearing stage

• High dynamic performance (cut‑off frequency >120 Hz)

• Air‑cushion preloading, zero friction

• High‑rigidity and heavy‑load design

• Resolution: 1 nm; repeatability: ±0.1 μm; positioning accuracy: ±0.2 μm

• Air‑gap averaging effect; straightness/flatness up to ±0.5 μm per 100 mm

• Travel up to 500 mm with cable management

• Optional high‑precision zero‑expansion grating feedback