Laser Processing Automation Solutions – PCB Drilling

Laser drilling is one of the earliest laser processing technologies to reach practical application and remains a major field of laser processing. For materials with high hardness and high melting points, traditional processing methods can no longer meet certain process requirements; such tasks are difficult to accomplish with conventional mechanical machining. Laser drilling, however, can reduce the spot diameter to the micrometre scale, and the concentrated laser power density enables drilling in almost any material. Compared with conventional methods such as mechanical drilling and electrical discharge machining (EDM), laser drilling offers significant advantages in both efficiency and quality. However, high‑precision drilling equipment imposes stringent requirements on motion stages and process software.

• AC brushless dual‑drive motors

• Travel ranges of dual‑drive axes and beam axis customisable according to customer requirements

• Maximum speed >2 m/s; maximum acceleration >2 g

• Z‑axis and rotary axes with various travel and load options available per customer needs

• Flexible cable management for optional cameras, air tubes, lasers, sensors, and other equipment

• Dual‑drive axes optionally available as standard platforms or customised marble‑based solutions

• Supports self‑created graphics or direct import of user‑defined processing patterns

• Motion platform parameters such as acceleration, velocity, and jerk can be configured within CADBridge

• View modes support zoom in/out and pan functions

• Supports path optimisation and import/export of guide lines

• Laser processing module parameters can be set, such as trigger spacing and laser pulse width

• Supports a variety of processing file formats, including DWG, DXF, GBR, and ROU

• Supports controllers such as ACS

Specifically for laser drilling applications, the software provides layered, modularised operation design, including parameter settings (galvo parameters, laser parameters, motion platform parameters, camera parameters, processing parameters, etc.), file import and editing, path planning, platform and galvo calibration, logging, and user management.