Semiconductor Wafer Inspection & IC Packaging Solutions – Die Bonder / Pick‑and‑Place Machine

Fully automatic die bonders (pick‑and‑place machines) are equipment used for high‑speed, high‑precision automatic placement of components, and are the most critical and complex piece of equipment in the entire SMT production line. Die bonders have evolved from early low‑speed mechanical pick‑and‑place machines to high‑speed optical centring systems, and are now moving towards multi‑functional, flexible, modular architectures. Coretech’s optimised motion solutions are suitable for various chip assembly processes, perfectly integrating customised motion subsystems with drive/control technology, vision systems, assembly heads, force‑control components, nozzles, feeders, substrates, and customised process software to deliver complete turnkey equipment with placement accuracy down to the micrometre level.