[Exhibition News] Riding the Wave of Precision Motion Control Once Again – Ground Motion Technology Makes a Stunning Appearance at Laser World of Photonics China!

The MINI‑X1‑Y1‑Z1 series 6‑axis high‑precision motion stage is purpose‑built for fiber‑optic coupling applications. Innovatively, it integrates a three‑axis micro‑adjustment mechanism on top of the ART130 series large‑stroke motion base (with X/Y/Z strokes customizable per customer requirements), enabling integrated "coarse adjustment over a wide range + nanometer‑level fine tuning." The repeatability positioning accuracy of each axis reaches within ±100 nm.

The product is adaptable to most optical communication module applications and offers advantages in precision, stability, and high settling speed for industrial integration. As soon as the new product was unveiled, it captured the attention of the audience, with its exquisite structural design and outstanding specifications making it a highlight of the show.

The 3‑axis spiral scanning air‑bearing stage for wafer inspection was also one of the focal points at the Ground Motion booth.

The ASP air‑bearing rotary stage achieves a dynamic balance grade of G0.4 under high‑speed rotation. When carrying a chuck at 6,000 rpm, the stage's disturbance to the linear axes is less than ±0.5 μm.

The system supports inspection at the 5 nm process node and significantly improves the efficiency and accuracy of wafer surface defect inspection through high‑speed dynamic response and nanometer‑level rotational precision.

As a 3‑axis integrated precision positioning platform combining vertical lifting and horizontal leveling, the ZTT‑V2 offers excellent micro‑motion accuracy and dynamic performance, with a load capacity of up to 10 kg and compatibility with cleanroom environments.

The product is ideally suited for applications that demand stringent micro‑motion and dynamic following errors, such as wafer inspection, optical alignment, panel inspection, or maskless lithography, where it adjusts height and angular attitude in real time based on sensor focusing data.

The FLAT‑XY series stage features an integrated XY design with a compact structure and strong driving capability. With a dual‑axis height of only 45 mm, it achieves a maximum speed of 500 mm/s and an unloaded acceleration of up to 1g.

The product is primarily used in optical fiber coupling in the communications field, wafer defect inspection in semiconductors, gene sequencing in biotech and medical applications, and laser micro‑nano processing.

The FAP series platform employs a 6‑DOF serial structure, enabling full‑range high‑precision displacement and angular adjustment. Its unloaded cutoff frequency reaches up to 100 Hz or more, making it a foundation for high‑volume manufacturing and assembly of photonic devices.

The FAP series achieves a minimum step size as low as 5 nm and speeds up to 400 mm/s. When combined with power meter energy analog input control, light‑searching algorithms, appropriate axis configurations, stroke options, and custom tooling designs, it precisely meets the alignment demands of next‑generation photonics packaging.