Wafer Defect Inspection
Semiconductor manufacturing involves complex processes, and rigorous inspection is required at nearly every step to ensure quality. Defective dies that slip through to subsequent stages not only compromise overall product quality but also drive up production costs significantly.
To address wafer surface defect and dimensional inspection needs, CoreTech offers a range of motion stages with diverse performance options for automated inspection equipment integrators. Supported inspection modes include serpentine on‑the‑fly linear scanning, area‑array camera point‑to‑point region inspection, and high‑speed spiral trajectory scanning—enabling accurate and efficient wafer screening.
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