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Laser Processing Automation Solutions – Wafer Grooving and LED Scribing
2026-06-03
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Wafer dicing equipment (dicing saws) is a critical part of packaging processes. LED scribing is also a key process for backlight units in electronic devices (smartphones, televisions, and tablets), as well as for automotive and general lighting panels. Laser scribing technology has a significant impact on improving yield and cutting efficiency, and accordingly places ever‑higher demands on the motion accuracy of dicing equipment. In combination with lasers of different pulse widths (nanosecond, picosecond, femtosecond) and vision/optical systems, Wuxi Coretech's ultra‑high‑precision motion control platforms complement laser stealth dicing processes in terms of cutting straightness, speed, and laser control. They overcome the limitations that conventional laser scribers impose on surface material, thickness, crystal orientation, and resistivity, achieving full process compatibility. This helps control product breakage rates and improve yield.
SMH Series Linear XY Stage
Direct‑drive motor high‑precision positioning stage
High‑performance, cost‑effective solution
Rugged mechanical structure
Flexible configuration options (various travels, table sizes, and feedback)
Travel range: 100 mm to 800 mm
Maximum speed up to 2000 mm/s; maximum acceleration up to 2 g
Optional single‑side or dual‑side cable management
CFTCA Series Open‑Frame (Large Aperture) Stage
XY integrated open‑frame direct‑drive stage, suitable for dual‑side scribing
High dynamic performance
Cross‑roller guides
Compact structure, low lateral height, reduced Abbe error
Travel options: 150 mm × 150 mm and 250 mm × 250 mm
Resolution: 1 nm; repeatability: ±150 nm; positioning accuracy: ±300 nm
In‑position stability: 3 nm (configured with linear driver, in vibration‑isolated laboratory environment)
Minimum step: 5 nm (with ASH feedback option and linear amplifier)
LAB Series Linear Stage
Direct‑drive air‑bearing stage
High dynamic performance (cut‑off frequency >120 Hz)
Air‑cushion preloading, zero friction
High‑rigidity and heavy‑load design
Resolution: 1 nm; repeatability: ±0.1 μm; positioning accuracy: ±0.2 μm
Air‑gap averaging effect; straightness/flatness up to ±0.5 μm per 100 mm
Travel up to 500 mm with cable management
Optional high‑precision zero‑expansion grating feedback
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