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Bonding
The bonding process for optical communication chips encompasses chip attachment and substrate interconnection, requiring multi‑axis coordinated alignment and synchronized force‑position control at micron‑level precision to achieve reliable interconnection between the photonic chip and its carrier.
CoreTech’s multi‑axis rotary stages and customized motion systems support serial or parallel structural designs, enabling precise attitude adjustment in 3D space and coordinated force‑position control—meeting the stringent requirements for placement accuracy and process stability in optical device packaging.
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Behind the Mass Production of Hybrid Bonding: How Precision Motion Stages Meet the High-Precision Control Demands of Semiconductor Packaging
From Optical Chip Manufacturing to Fiber Coupling: Ultra‑Precision Motion Control Platforms Enabling a Technological Leap in the Optical Communications Industry
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