Wafer Direct-Write & Mask Lithography

Carries the wafer for large‑step positioning and field‑by‑field scanning exposure, with real‑time dynamic compensation for focal plane deviation and rotation error, ensuring pattern placement accuracy and focus quality.

High‑precision air‑bearing stage eliminates stick‑slip, hysteresis, and particle contamination from mechanical contact, while maintaining sub‑micron flatness—significantly improving positioning repeatability and exposure field stitching accuracy for direct‑write lithography systems.