Wafer Grooving & LED Scribing

Wafer grooving and LED laser scribing are critical processes in precision laser processing, demanding high accuracy, edge quality, and throughput. Coretech’s high‑precision motion stages, leveraging superior dynamic performance and multi‑axis coordinated control, enable micron‑level trajectory tracking on wafer or LED substrate surfaces. Coupled with short‑pulse laser systems, they deliver high‑quality grooving and scribing. The solution is suitable for various hard‑brittle materials and composites, effectively minimizing the heat‑affected zone, improving kerf quality and die yield, and meeting the precision cutting requirements of advanced packaging and semiconductor device manufacturing.