PCB Drilling

Laser drilling is one of the earliest industrialized and most widely adopted laser processing technologies. For materials with high hardness and high melting points, conventional mechanical methods often fail to meet precision and efficiency requirements. Laser drilling focuses the beam to a micron‑scale spot diameter and, with its extremely high power density, significantly outperforms traditional processes such as mechanical drilling and electrical discharge machining in both throughput and hole quality. In this application, Coretech’s high‑precision motion stages provide a stable and reliable motion foundation with flexible process control, effectively supporting challenging tasks such as micro‑holes and multi‑hole arrays.