# # CN Contact Us
# #

Die Attach

Die Attach

Fully automatic pick‑and‑place machines are core equipment for high‑speed, high‑precision component mounting, representing the most critical and complex link in the entire SMT production line. Evolution has progressed from early low‑speed mechanical mounting to high‑speed optical alignment mounting, and continues toward multifunctionality, flexible interconnection, and modularity.

CoreTech offers optimized motion solutions widely applicable to various chip mounting processes. We integrate customized motion subsystems with drives, controls, vision systems, assembly heads, force‑control components, nozzles, feeders, substrates, and other modules, complemented by tailored process software—delivering complete turnkey equipment with micron‑level placement accuracy.

Recommended Products

Empowerment Case Studies

Semiconductor Wafer Inspection & IC Packaging Solutions – Die Bonder / Pick‑and‑Place Machine
Semiconductor Wafer Inspection & IC Packaging Solutions – Die Bonder / Pick‑and‑Place Machine
Semiconductor Wafer Inspection & IC Packaging Solutions – Die Bonder / Pick‑and‑Place Machine Semiconductor Wafer Inspection & IC Packaging Solutions – Die Bonder / Pick‑and‑Place Machine
Need engineer assistance for product selection or a quote?

Need engineer assistance for product selection or a quote?

Contact us to create your customized precision motion solution.

Leave a message now
Leave a message now Leave a message now