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Optical Chip Manufacturing & Testing
In the front‑end manufacturing and wafer‑level testing of optical communication chips, processes such as film thickness measurement, defect inspection, and critical dimension metrology impose stringent requirements on positioning accuracy and dynamic scanning performance of motion stages.
CoreTech’s air‑bearing linear and rotary stages offer nanometer‑level repeat positioning accuracy and excellent geometric performance. Combined with spiral trajectory motion control and equal‑arc‑length trigger functionality, they meet the dual demands of high‑speed scanning and high‑precision sampling in optical chip wafer inspection.
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From Optical Chip Manufacturing to Fiber Coupling: Ultra‑Precision Motion Control Platforms Enabling a Technological Leap in the Optical Communications Industry
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