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Wafer Grooving & Stealth Dicing
Wafer dicing equipment (dicing saw) is core to packaging, separating full wafers into individual chips. Dicing quality directly impacts yield and packaging efficiency—larger wafers demand higher motion precision.
CoreTech’s ultra-high-precision motion stage, compatible with nanosecond, picosecond, and femtosecond lasers and vision-optical systems, synergizes with stealth dicing in cutting straightness, speed, and laser control. It overcomes limitations of wafer surface material, thickness, crystal orientation, and resistivity, enabling full process compatibility, reducing breakage, and improving chip yield.
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