Film Thickness Measurement

Film thickness measurement is a critical step in semiconductor process monitoring, as its accuracy and stability directly affect the evaluation of deposition, etching, and other thin‑film processes.

CoreTech’s high‑precision motion stages provide exceptional positioning stability and motion smoothness for film thickness measurement equipment, ensuring fast, accurate spot‑based and scanning measurements of the probe over the wafer surface. They effectively support various measurement principles including spectroscopic ellipsometry and interferometry, enabling high‑repeatability, high‑reliability in‑line process control and providing key assurance for yield improvement.